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Rigid-Flex PCB

Rigid-Flex PCB

Rigid flex joint board is a product formed by local material stacking differences through processes such as pressing and opening, which has both FPC and PCB characteristics. It can improve the design flexibility of limited space and meet the complex requirements of welding and 3D assembly applications; With the development of technology, advanced products such as High Level Interconnect (HDI) are gradually being mass-produced. At present, rigid flex joint plates are widely used in high-end consumer electronics, intelligent terminals, displays, aerospace, military and other fields.

Product Features

Specifications&Parameters

  • Production capacity
  • Supporting full process capability from FPC to SMT, providing customers with one-stop service
  • Minimum outer line width/spacing
  • 50μm/50μm
  • Mass production layers
  • 6 floors and below
  • Thickness of hard board area
  • 0.2-1.6mm
  • HDI blind/buried hole
  • Mechanical through-hole ≥ 0.1mm, blind hole diameter ≥ 75 μ m; Multi stage blind hole stacking design
  • Stacked design
  • Multiple stacking schemes and special asymmetric stacking designs such as 1+1+2+1+1 and 2+2+2 in the hard board area
  • Blind and through holes
  • Blind hole A/R ≤ 0.7:1, through-hole A/R ≤ 8:1